Power Supply Wire Sizing Considering Self-Heating in Bulk-to-SOI Migrated Designs
نویسندگان
چکیده
This work presents a case study for the investigation of the interconnects reliability while migrating from a traditional CMOS Bulk to a SOI technology. The Bulk-to-SOI migration has been recently explored, even considering the improvements and drawbacks related to SOI, including low power advantages of this technology and low thermal properties as well. The focus point of this paper is the estimation of the electromigration risk in power supply wire when a given architecture migrates to a SOI technology for exploiting its low power characteristics. The evaluations performed in this work take into account the impact of several parameters on the metal wires lifetime; an high level test structure has been realized to point out the effect of design and technology parameters on Time-to-Fail.
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